Investigation on Thermal Performance of a Simple Electronic Board Using Different Phase Change Material Packaging Types
Phase change materials are some kind of energy storage systems which have widely been used in many industries such as electronic equipment, heat pumps, buildings, food transportation, solar panels and spacecraft thermal control applications. Two main outstanding features of phase change materials are having large amount of energy storage capacity at low temperature difference between heat source-sink pair and being remained at almost constant temperature during phase change process. Phase change materials have a capability of absorbing and releasing heat during phase transition cycles, which results in the charging and discharging. Based on studies in literature, phase change material technology is one of the most active research fields for thermal energy storage with higher efficiency. In recent years, improving the thermophysical properties of the phase change materials are widely concentrated. Many performance enhancements are made to increase the usage area of phase change materials. There are some restrictions in the application processes of these materials. In order to overcome these restrictions, adding different additives to phase change materials to increase the overall thermal conductivity is one of the methods used. In this study, the thermal performance of phase change materials for passive cooling of electronic modules with heating components is investigated numerically. A commercially available phase change material is employed in the study. Effects of different packaging types for phase change material on thermal performance of the electronics board are examined. Three different packaging types are considered; bulk phase change material inside a rectangular enclosure, a rectangular enclosure having rectangular fins with phase change material inside and a rectangular enclosure whose inside is in foam structure. All of the enclosures containing the phase change material is made up of aluminium. The outer dimensions of the enclosures are the same for all package types. All of the phase change material packages are placed over the heating component of the electronics board in the same environmental condition. Finally, the electronics board is analysed without using phase change material. Foregoing configurations are compared in terms of thermal performance. Computations are performed in three dimensions using a conduction based finite element method. Computational method is verified by time dependent temperature measurements of the package inside an aluminium enclosure with phase change material. A single domain latent heat - enthalpy method is used to model the effects of phase change. Results for different cases are presented comparatively in the form of time dependent variations of package temperature, isothermal contours and melting locations.
Investigation on Thermal Performance of a Simple Electronic Board Using Different Phase Change Material Packaging Types
Category
Technical Paper Publication
Description
Session: 11-49-01 Electronics Thermal Management
ASME Paper Number: IMECE2020-23729
Session Start Time: November 17, 2020, 03:20 PM
Presenting Author: Emir Özkökdemir
Presenting Author Bio: No
Authors: Emir Ozkokdemir Roketsan Inc.
Yener Usul Roketsan Inc.