Session: 11-05-02: Thermophysical Properties: Characterization and Modeling Across Scales

Paper Number: 142510

142510 - Spatially Resolved Lock-in Micro-Thermography (Sr-Lit): A Tensor Analysis-Enhanced Method for Anisotropic Thermal Characterization 

While high-throughput (HT) computations have streamlined the discovery of promising new materials, experimental characterization remains challenging and time-consuming. One significant bottleneck is the lack of an HT thermal characterization technique capable of analyzing advanced materials exhibiting varying surface roughness and in-plane anisotropy. To tackle these challenges, we introduce spatially resolved lock-in micro-thermography (SR-LIT), an innovative technique enhanced by tensor analysis for optical thermal characterization. Our comprehensive analysis and experimental findings showcase notable advancements: We present a novel tensor-based methodology that surpasses the limitations of vector-based analysis prevalent in existing techniques, significantly enhancing the characterization of arbitrary in-plane anisotropic thermal conductivity tensors. On the instrumental side, we introduce a straightforward camera-based detection system that, when combined with the tensor-based methodology, enables HT thermal measurements. This technique requires minimal sample preparation and enables the determination of the entire in-plane thermal conductivity tensor with a single data acquisition lasting under 40 seconds, demonstrating a time efficiency over 90 times superior to state-of-the-art HT thermology. Additionally, our method accommodates millimeter-sized samples with poor surface finish, tolerating surface roughness up to . These features highlight an innovative approach to realizing HT and accurate thermal characterization across various research areas and real-world applications.

Presenting Author: Dihui Wang University of Pittsburgh

Presenting Author Biography: Dihui Wang is a PhD candidate at the University of Pittsburgh, specializing in the experimental development of thermal property characterization.

Authors:

Dihui Wang University of Pittsburgh
Heng Ban University of Pittsburgh