Session: 12-26-01: Mechanics and Materials of Soft Electronics

Paper Number: 146014

146014 - Investigating the Effect of Single Phase Liquid Immersion Cooling on Tg-400 Substrate Core's Thermomechanical Characteristics 

The exponential increase in server power density and heat generation within data centers, driven by the processing and storage of massive data volumes, has necessitated a significant focus on efficient cooling technologies. Conventional air-cooled data centers dedicate a substantial portion of energy to cooling information technology equipment (ITE), highlighting the need for alternative cooling solutions. Single-phase liquid immersion cooling (Sp-LIC) has emerged as a promising approach, offering enhanced thermal mass and efficient heat dissipation, particularly suitable for hyper-scale, edge, and modular data center applications.

This study explores the impact of single-phase liquid immersion cooling fluids on the thermomechanical properties of the TG-400 substrate core, a crucial component in electronic packaging. Building upon previous research focused on a different substrate core material, I-Speed, this study extends the analysis to TG-400. The key properties under scrutiny include the Elastic Modulus (E) and Glass Transition Temperature (Tg), which are critical for the mechanical design and reliability assessment of electronic packages.

The investigation subjects the TG-400 substrate core to thermal aging in various immersion cooling fluids, specifically synthetic hydrocarbon fluid (EC100) and Polyalphaolefin 6 (PAO 6), as well as exposure to ambient air. Aging occurs at two distinct temperatures, 85°C and 125°C, over a period of 720 hours for each condition. The study assesses changes in the complex modulus pre- and post-aging, offering insights into the material's behavior under different thermal conditions and immersion cooling environments.

The results reveal that the modulus of baseline samples is generally higher than those aged at 85°C and 125°C in different media, and the modulus values decrease with increasing temperature across all sample variants. Notably, the modulus of samples immersed in PAO-6 at both temperatures displayed unique trends, underscoring the complex interactions between material properties and cooling environments.

Additionally, the analysis of the glass transition temperature of samples immersed in EC-100 and PAO-6, aged at 85°C, showed minimal differences compared to baseline samples. This indicates that immersion cooling fluids do not significantly alter Tg, ensuring the reliability of TG-400 in varying cooling environments.

This research contributes to a deeper understanding of the reliability and failure mechanisms associated with immersion cooling technologies, which is essential for advancing efficient and sustainable data center cooling strategies. By examining both the Elastic Modulus and Glass Transition Temperature of the TG-400 substrate core, this study enhances our knowledge of material compatibility and performance in immersive cooling settings. The findings aid in the development of robust electronic packaging designs, crucial for the infrastructure of modern data centers, ensuring improved energy efficiency and thermal management.

Presenting Author: Rohit Suthar University of Texas at Arlington

Presenting Author Biography: Rohit Kumar Suthar is a second-year Ph.D. student in the Mechanical & Aerospace Engineering department at the University of Texas at Arlington. They are affiliated with the EMNSPC (Electronics, MEMS, and Nanoelectronics Systems Packaging Center) lab under the supervision of Dr. Dereje Agonafer.
With a focus on Electronics Packaging and Data Center Cooling Solutions, he is actively engaged in research aimed at optimizing thermal management strategies for electronic systems. Their expertise lies in developing innovative cooling solutions to enhance the performance and reliability of data centers, contributing to advancements in sustainable and efficient cooling technologies.

Authors:

Rohit Suthar University of Texas at Arlington
Pratik Bansode University of Texas at Arlington
Venkateshwar Vishnu Tirupati Venkatachalam University of Texas at Arlington
Naga Tejesh Ede University of Texas at Arlington
Akshay Lakshminarayana University of Texas at Arlington
Rabin Bhandari University of Texas at Arlington
Akiilessh Sivakumar University of Texas at Arlington
Dereje Agonafer University of Texas at Arlington