Session: 12-26-01: Mechanics and Materials of Soft Electronics

Paper Number: 150967

150967 - Mechanically Guided Three-Dimensional Assembly of Soft Electronics and Microfluidics 

Sophisticated three-dimensional (3D) architectures are omnipresent in nearly all forms of life, where they support essential functions across multiple length scales. Development of complex 3D functional mesoscopic structures in advanced materials for creating conformal and seamless bio-interfaces is a topic of increasing research interest. Previous options in forming 3D mesostructures are, however, constrained by a narrow accessible range of materials or 3D geometries. I will first introduce a versatile, mechanical approach to deterministically assemble sophisticated 3D mesoscale structures, guided by mechanics analysis, from planar 2D structures through controlled compressive buckling. The mechanically guided 3D assembly approach works seamlessly with nearly any class of materials (e.g., semiconductors, metals, and polymers) and across length scales from nano to macro, in a parallel, high-throughput fashion. Based on this mechanical assembly approach, many unique opportunities for 3D bio-integrated functional systems exist, for example, 3D multifunctional neural interfaces for cortical spheroids and 3D artificial microvascular networks. Precisely defined 3D geometries and deterministically distributed functional components through well-defined volumetric spaces, for unconventional approaches to neuromodulation, sensing, and regulation, highlight the design versatility driven by mechanics analysis. The deterministic assembly of sophisticated 3D microvascular networks offers diverse geometrical layouts, high-resolution features (e.g., 4-µm wide microchannels), and the unique ability to integrate active functionality through embedded sensors and actuators, demonstrating physiologically relevant functionalities in both fluid transporting and sensing/regulating.

Sophisticated three-dimensional (3D) architectures are omnipresent in nearly all forms of life, where they support essential functions across multiple length scales. Development of complex 3D functional mesoscopic structures in advanced materials for creating conformal and seamless bio-interfaces is a topic of increasing research interest. Previous options in forming 3D mesostructures are, however, constrained by a narrow accessible range of materials or 3D geometries. I will first introduce a versatile, mechanical approach to deterministically assemble sophisticated 3D mesoscale structures, guided by mechanics analysis, from planar 2D structures through controlled compressive buckling. The mechanically guided 3D assembly approach works seamlessly with nearly any class of materials (e.g., semiconductors, metals, and polymers) and across length scales from nano to macro, in a parallel, high-throughput fashion. Based on this mechanical assembly approach, many unique opportunities for 3D bio-integrated functional systems exist, for example, 3D multifunctional neural interfaces for cortical spheroids and 3D artificial microvascular networks. Precisely defined 3D geometries and deterministically distributed functional components through well-defined volumetric spaces, for unconventional approaches to neuromodulation, sensing, and regulation, highlight the design versatility driven by mechanics analysis. The deterministic assembly of sophisticated 3D microvascular networks offers diverse geometrical layouts, high-resolution features (e.g., 4-µm wide microchannels), and the unique ability to integrate active functionality through embedded sensors and actuators, demonstrating physiologically relevant functionalities in both fluid transporting and sensing/regulating.

Presenting Author: Haiwen Luan University of California, San Diego

Presenting Author Biography: Haiwen Luan is an Assistant Professor in the Department of Mechanical and Aerospace Engineering at the University of California, San Diego. Prior to this, he was a postdoctoral scholar in the Querrey Simpson Institute for Bioelectronics at Northwestern University. He earned his PhD in Mechanical Engineering from Northwestern University in 2019. Dr. Luan was recognized in the MIT Technology Review Innovators Under 35 China 2023 list. His research focuses on mechanically guided 3D assembly for multifunctional bio-interfaces, bio-integrated electronics and microfluidics, as well as programmable and reconfigurable microsystems.

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