Session: 16-01-01: Government Agency Student Poster Competition

Paper Number: 150503

150503 - Dynamic Deformation of Pdms Stamps in Roll-to-Roll Microcontact Printing 

Roll-to-roll (R2R) microcontact printing (µCP) leverages a rolling stamp to continuously transfer intricate patterns onto a moving substrate. This technology is crucial for the high-throughput production of micro- and nanoscale devices, offering a versatile and scalable approach to pattern transfer. The fidelity of the transferred pattern relies on successful mechanical contact between the PDMS stamp and the substrate. However, the PDMS stamp can often collapse or buckle under improper pressure. Therefore, in this work, simulation and experimental studies are conducted to better understand the dynamic deformation of PDMS stamps during microcontact printing.

In the simulation, we utilized Ansys to design a comprehensive model capable of simulating contact area changes under varying pressures for different stamp geometries, including traditional rectangular and circular patterns, as well as conical patterns. By systematically varying the applied pressure for the rectangular and circular patterns, we mapped out the pressure-contact area relationship and identified the critical pressure points at which significant deformation or buckling occurs. Additionally, we explored conical PDMS stamps to understand how their shape influences the distribution of pressure and the resultant contact area.

Following the simulation, we devised a single roller system to verify the results experimentally. In our setup, we used the FMS RMGZ 922 Force Measuring Roller to measure the pressure, with the PDMS print pattern securely attached to the roller. A glass plate, positioned beneath the print pattern and connected to a moving arm, created friction force with the pattern, causing the roller to move and simulate the continuous motion of the R2R system. A camera placed underneath the glass plate captured detailed images of the print pattern, while a rail system allowed for height adjustment between the roller and the glass plate, enabling variable force examination and analysis of the relationship between pressure and contact area.

Our initial experiments replicated the contact area changes under varying pressure for traditional rectangular and circular patterns. By adjusting the pressure, we observed the degree and nature of deformation, providing a clear understanding of the mechanical behavior of PDMS stamps under different conditions. Our findings reveal specific pressure thresholds beyond which the PDMS stamps begin to collapse or buckle. Identifying these thresholds is crucial for optimizing the R2R system.

Beyond the traditional patterns, our single roller system revealed how the conical shape influences the pressure distribution and the resulting contact area changes. Insights from these conical pattern simulations can inform the design of more resilient and effective PDMS stamps for R2R µCP, particularly in applications requiring complex or non-standard pattern geometries. The data obtained from studying conical PDMS stamps is valuable for industries looking to implement R2R µCP with non-traditional patterns, thereby expanding the range of possible applications for this technology.

Presenting Author: Huarui Du University of Massachusetts Amherst

Presenting Author Biography: Huarui Du is currently pursuing a bachelor’s degree in mechanical engineering at the University of Massachusetts Amherst. Despite being in the early stages of their academic career, Huarui shows a strong passion for engineering and a dedication to mastering the fundamental principles of the field. He is particularly interested in automation, mechanical fault diagnosis, and CAD modeling. Huarui is actively involved in student organizations such as the American Society of Mechanical Engineers (ASME) and the Chinese student scholar association(CSSA). Huarui is eager to gain hands-on experience through research, where he hopes to apply his theoretical knowledge to real-life problems. With a commitment to innovation and education, Huarui aspires to make significant contributions to the field of mechanical engineering, helping to advance sustainable and efficient technologies in the future.

Authors:

Huarui Du University of Massachusetts Amherst
Hannah Kwon University of Massachusetts Amherst
Isabella Lambros University of Massachusetts Amherst
Iiya Mccune-Pedit University of Massachusetts Amherst
Jingyang Yan University of Massachusetts Amherst
Xian Du University of Massachusetts Amherst