Session: 12-08-01: Peridynamic Modeling of Materials’ Behavior

Paper Number: 100080

100080 - Modeling Crack Initiation and Propagation in Electrodeposition Processes via Peridynamics 

To achieve effective repair of pitting corrosion, after cleaning, electroplating can be used to fill up the pits and reduce the surface roughness. However, during electroplating, certain undesired defects, such as voids and cracks [1], are introduced. Such microcracks may lead to localized corrosion, a decrease in use life, or even deposit spallation from the substrate [2]. These are thought to be caused by residual stresses, rapid and uneven cooling, etc. To avoid the formation of such defects, an accurate and validated computational model that could guide optimizing the design of the electroplating process is needed. 
Here we introduce a coupled electro-chemo-mechanical peridynamic (PD) model to simulate the buildup of residual stresses and how they initiated cracks during electroplating. The electroplating deposition is modeled as a growth process that has autonomous evolution on the electroplating plate. Physical mechanisms taking place during growth deposition (lattice mismatch between the substrate and the deposits [3], restrictions caused by the substrate geometry [4], and volume changes due to thermal expansion/shrinkage) are taken into account in the model. These mechanisms lead to the buildup of residual stresses. Mechanical equilibrium is performed to check crack initiation due to the presence of residual stresses. 
We verify and validate the model against experimental results in [5]. Future steps include integrating more factors that can affect the crack behavior. 
Keywords: peridynamics, electrodeposition, nonlocal model, crack initiation.
Acknowledgments: This work was supported in part by ONR SBIR award and by the US National Science Foundation Grant No. 1953346. This work was completed utilizing the Holland Computing Center of the University of Nebraska, which receives support from the Nebraska Research Initiative. 
References
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[2]    K. Guo, R. Kumar, X. Xiao, B. W. Sheldon, and H. Gao, “Failure progression in the solid electrolyte interphase (SEI) on silicon electrodes,” Nano Energy, vol. 68, no. November 2019, p. 104257, 2020, doi: 10.1016/j.nanoen.2019.104257.
[3]    A. M. Engwall, Z. Rao, and E. Chason, “Origins of residual stress in thin films: Interaction between microstructure and growth kinetics,” Mater. Des., vol. 110, pp. 616–623, 2016, doi: 10.1016/j.matdes.2016.07.089.
[4]    D. Yin, C. J. Marvel, F. Y. Cui, R. P. Vinci, and M. P. Harmer, “Microstructure and fracture toughness of electrodeposited Ni-21 at.% W alloy thick films,” Acta Mater., vol. 143, pp. 272–280, 2018, doi: 10.1016/j.actamat.2017.10.001.
[5]    H. P. Feng, M. Y. Cheng, Y. L. Wang, S. C. Chang, Y. Y. Wang, and C. C. Wan, “Mechanism for Cu void defect on various electroplated film conditions,” Thin Solid Films, vol. 498, no. 1–2, pp. 56–59, 2006, doi: 10.1016/j.tsf.2005.07.062.

Presenting Author: Longzhen Wang University of Nebraska-Lincoln

Presenting Author Biography: Longzhen is a PhD Candidate in University of Nebraska-Lincoln. His research is focus on Peridynamics, Solid mechanics, Fracture mechanics.

Authors:

Longzhen Wang University of Nebraska-Lincoln
Florin Bobaru University of Nebraska-Lincoln