Session: ASME Undergraduate Student Design Expo
Paper Number: 171682
Optimization of Heatsink Design for Efficient Cooling of 3d Printer Controllers
Efficient thermal management is critical for the stable operation and longevity of 3D printer controllers, which often experience performance degradation and hardware failure due to excessive heat buildup. This project focuses on the optimization of heatsink design to enhance the cooling efficiency of 3D printer control boards. By integrating principles of thermodynamics, material science, and computational fluid dynamics (CFD), various heatsink geometries and materials were analyzed to identify the most effective configurations. Simulations were conducted to evaluate parameters such as temperature distribution, heat dissipation rate, and airflow patterns. Prototypes of the optimized heatsinks were then fabricated and tested under real-world operating conditions. The results demonstrated a significant reduction in peak operating temperatures, improved thermal stability, and increased reliability of the 3D printer controllers.Efficient thermal management is critical for the stable operation and longevity of 3D printer controllers, which often experience performance degradation and hardware failure due to excessive heat buildup. This project focuses on the optimization of heatsink design to enhance the cooling efficiency of 3D printer control boards. By integrating principles of thermodynamics, material science, and computational fluid dynamics (CFD), various heatsink geometries and materials were analyzed to identify the most effective configurations. Simulations were conducted to evaluate parameters such as temperature distribution, heat dissipation rate, and airflow patterns. Prototypes of the optimized heatsinks were then fabricated and tested under real-world operating conditions. The results demonstrated a significant reduction in peak operating temperatures, improved thermal stability, and increased reliability of the 3D printer controllers.Efficient thermal management is critical for the stable operation and longevity of 3D printer controllers, which often experience performance degradation and hardware failure due to excessive heat buildup. This project focuses on the optimization of heatsink design to enhance the cooling efficiency of 3D printer control boards. By integrating principles of thermodynamics, material science, and computational fluid dynamics (CFD), various heatsink geometries and materials were analyzed to identify the most effective configurations. Simulations were conducted to evaluate parameters such as temperature distribution, heat dissipation rate, and airflow patterns. Prototypes of the optimized heatsinks were then fabricated and tested under real-world operating conditions. The results demonstrated a significant reduction in peak operating temperatures, improved thermal stability, and increased reliability of the 3D printer controllers.Efficient thermal management is critical for the stable operation and longevity of 3D printer controllers, which often experience performance degradation and hardware failure due to excessive heat buildup. This project focuses on the optimization of heatsink design to enhance the cooling efficiency of 3D printer control boards. By integrating principles of thermodynamics, material science, and computational fluid dynamics (CFD), various heatsink geometries and materials were analyzed to identify the most effective configurations. Simulations were conducted to evaluate parameters such as temperature distribution, heat dissipation rate, and airflow patterns. Prototypes of the optimized heatsinks were then fabricated and tested under real-world operating conditions. The results demonstrated a significant reduction in peak operating temperatures, improved thermal stability, and increased reliability of the 3D printer controllers.
Presenting Author: Deepak K SRM University
Presenting Author Biography: Deepakkkm
Authors:
Deepak K SRM UniversityOptimization of Heatsink Design for Efficient Cooling of 3d Printer Controllers
Paper Type
Undergraduate Expo