Session: Research Posters

Paper Number: 173051

Electrodeposition-Based Additive Manufacturing: Process Optimization for Sustainable and High-Resolution Metal Printing 

Additive manufacturing (AM) has transformed the fabrication of complex metal parts, enabling layer-by-layer construction of geometries that are difficult or impossible to achieve using conventional subtractive processes. However, most metal AM technologies rely heavily on high-temperature thermal processes, such as selective laser melting (SLM) and binder jetting with sintering, which impose significant limitations. These include high energy consumption, poor surface resolution at the microscale, thermal stress and distortion, and the need for extensive post-processing to remove binders and enhance density. Furthermore, the harsh thermal environments make it challenging to fabricate metal parts directly on sensitive substrates or to integrate diverse material systems. As the demand for miniaturized, high-performance components in electronics, sensors, and biomedical devices increases, there is a growing need for alternative AM technologies that are energy-efficient, low-temperature, and capable of producing fine-resolution metal features.

Electrochemical additive manufacturing (ECAM) has emerged as a promising low-energy alternative to traditional thermal AM, offering direct metal deposition from a liquid electrolyte without requiring heat or binders. However, current ECAM approaches—such as meniscus-confined electrodeposition, jet electrodeposition, and tip-based techniques—primarily rely on point-wise deposition mechanisms. These techniques are inherently slow, difficult to scale for large-area fabrication, and limited in pattern complexity. To address these challenges, we present a novel, image-guided, layer-by-layer ECAM method that enables high-resolution metal structure fabrication using photopatterned polymer masks and parallel electrodeposition.

The purpose of this research is to establish a scalable and energy-efficient fabrication platform capable of producing dense, high-fidelity metal structures at the microscale. The core contribution of this work lies in integrating digital light processing (DLP) technology for mask patterning with electrochemical deposition in a sequential, modular workflow. This approach not only overcomes the speed and scalability limitations of point-based ECAM but also eliminates the need for binders, thermal processing, or complex lithography techniques.

The fabrication methodology is based on a two-step experimental setup. First, a top-down DLP projection system is used to pattern a UV-curable polymer mask directly on a conductive metal substrate. The digital mask is projected onto the resin-coated surface, selectively curing regions where metal growth is to be inhibited. After the polymer pattern is developed and fixed, the masked substrate is transferred to an electrochemical deposition bath. In this second stage, the conductive substrate serves as the cathode, while a metal wire acts as the anode. Metal ions from the electrolyte are reduced and deposited only in the exposed regions not covered by the polymer mask. This process enables highly localized, layer-specific metal growth controlled by both the geometry of the mask and the electrochemical parameters.

A systematic parametric study was conducted to investigate the effects of applied current, acid concentration, and layer thickness on the quality of deposited metal structures. The deposition quality was characterized by using scanning electron microscopy (SEM), optical microscopy, and profilometry. Preliminary results demonstrate that intermediate current densities (15–25 mA) combined with moderate acid concentrations (10–20 wt.%) yield smoother surfaces and more uniform grain structures. Additionally, optimization of layer thickness and exposure time was shown to enhance vertical resolution and reduce processing time. Dense, well-adhered metal structures with feature sizes down to 20 µm were successfully fabricated with excellent fidelity and minimal defects.

This novel ECAM approach offers several critical advantages over conventional metal AM and existing electrochemical methods. Unlike point-based ECAM, our image-guided process enables parallel deposition across the entire patterned area, significantly increasing fabrication speed. The low-temperature, binder-free nature of the process reduces environmental impact and simplifies post-processing, making it both cost-effective and sustainable. Furthermore, the method is easily scalable and adaptable to various metal systems, making it suitable for applications in microelectronics, lab-on-chip devices, MEMS components, and other areas requiring precise metal microstructures.

In conclusion, this work establishes a robust, high-resolution, and energy-efficient platform for additive manufacturing of metallic structures using electrochemical processes. By combining DLP-based photopatterning with localized electrodeposition, the proposed method addresses key limitations in scalability, resolution, and environmental sustainability. This research contributes to the advancement of electrochemical AM by providing a flexible framework for fabricating fine-featured, structurally sound metal parts with broad application potential in science and engineering.

Presenting Author: Shah Md Ashiquzzaman Nipu Arizona State University

Presenting Author Biography: Shah Md. Ashiquzzaman Nipu is a Ph.D. student in the Department of Manufacturing Engineering at Arizona State University. His research focuses on advanced additive manufacturing, particularly electrochemical and hybrid metal/polymer fabrication for structural and sensing applications.

Authors:

Shah Md Ashiquzzaman Nipu Arizona State University
Xiangjia Li Arizona State University