Session: Research Posters

Paper Number: 173831

Simulation of Electrodeposition With a Peridynamic Model 

Depending on the electrochemical conditions, electrodeposition in through-silicon vias can lead to undesirable defects encapsulated in the deposited material or seams that affect the conductivity of the connections. In this presentation, we introduce a Peridynamic (PD) model of electrodeposition based on the dissolution (corrosion) models from [1]. The PD model contrasts with methods requiring explicit interface tracking. The model is discretized using the Fast Convolution-Based Method (FCBM) [2, 3].

This numerical implementation enables efficient simulation in three-dimensional domains, with the flexibility to incorporate heterogeneous material properties and evolving deposition geometries. By avoiding mesh conformity to moving boundaries, the approach simplifies the handling of complex interfacial behavior. It also allows for greater adaptability when extending the model to irregular TSV topologies and stochastic surface growth phenomena, which are often observed in industrial applications, specifically in the microconductors manufacturing.

 We simulate the merger and coalescence of the deposition fronts and validate the model for various filling scenarios of electrodeposition in through-silicon-vias (TSVs) [4]. We correctly predict the experimentally observed depositions for subconformal and conformal filling of TSVs.

Furthermore, the nonlocal nature of the Peridynamic formulation makes it suitable for investigating morphological instabilities and defect formation in early growth stages. This opens avenues for coupling the model with electric field simulations and surfactant effects, aiming toward a more physically complete description of superconformal dynamics.

For superconformal filling, we explain why the current model is not sufficient and propose future developments.

Acknowledgments: This work was supported by NSF award #1953346.

References

[1] Jafarzadeh, Siavash, Jiangming Zhao, Mahmoud Shakouri, and Florin Bobaru. "A peridynamic model for crevice corrosion damage." Electrochimica Acta 401 (2022): 139512. https://doi.org/10.1016/j.electacta.2021.139512

[2] Jafarzadeh, Siavash, Farzaneh Mousavi, Adam Larios, and Florin Bobaru. "A general and fast convolution-based method for peridynamics: applications to elasticity and brittle fracture." Computer Methods in Applied Mechanics and Engineering 392 (2022): 114666. https://doi.org/10.1016/j.cma.2022.114666

[3] Wang, Longzhen, Siavash Jafarzadeh, Farzaneh Mousavi, and Florin Bobaru. "PeriFast/corrosion: a 3d pseudospectral peridynamic Matlab code for corrosion." Journal of Peridynamics and Nonlocal Modeling (2023): 1-25. https://doi.org/10.1007/s42102-023-00098-5

[4] Wang, Fuliang, Zhipeng Zhao, Nantian Nie, Feng Wang, and Wenhui Zhu. "Dynamic through-silicon-via filling process using copper electrochemical deposition at different current densities." Scientific Reports 7, no. 1 (2017): 46639. https://doi.org/10.1038/srep46639

Presenting Author: Diego Salazar University of Nebraska-Lincoln

Presenting Author Biography: Diego Salazar is a Ph.D. candidate in Mechanical and Materials Engineering at the University of Nebraska–Lincoln. His research focuses on computational modeling of Electrochemical and Mechanical phenomena, fracture and damage in heterogeneous materials using Peridynamics, with a particular interest in fiber-reinforced composites, interfacial mechanics, and electrodeposition processes. He combines spectral methods and adaptive numerical techniques to improve the efficiency and scalability of nonlocal simulations. Diego holds a strong background in mathematics and is deeply engaged in interdisciplinary work connecting physics-based modeling, simulation, and material science.
Diego holds a Master's in Pure and Applied Mathematics at the University Central del Ecuador and a Bachelor's in Mathematics at Escuela Politécnica Nacional, Quito-Ecuador.
Diego also enjoys outdoor activities, yoga, and martial arts.

Authors:

Diego Salazar University of Nebraska-Lincoln
Florin Bobaru University of Nebraska-Lincoln